Integrated Circuit Topography

Integrated Circuit Topography

Integrated circuit topography protection covers the three-dimensional arrangement of layers forming an integrated circuit, represented by images fixed in any format for production purposes.

Integrated Circuit Topography

Integrated Circuit Topography

Integrated circuit topography protection covers the three-dimensional arrangement of layers forming an integrated circuit, represented by images fixed in any format for production purposes.

  • Dış Patent provides guidance and follow-up for domestic and international registration procedures relating to integrated circuit topographies.

Process

Every application is tailored to its subject; the core workflow covers planning, filing, prosecution and protection.

INTEGRATED CIRCUIT TOPOGRAPHY PROCESS
01 01

Initial Assessment

We clarify the subject of the request, applicant information and protection objectives together.

02 02

Research and Strategy

We assess similarity, novelty, scope and risk to establish the most suitable filing route.

03 03

Filing and Follow-up

We prepare the application and monitor office communications, objections and interim decisions.

04 04

Protection and Monitoring

After registration, we manage renewals, monitoring, objections and legal action when needed.

Application Preparation Checklist

Having the following information ready helps the initial assessment move quickly.

  • Applicant or company information
  • A brief description of the trademark, invention, design or service
  • Available logos, visuals, technical drawings, specifications or product images
  • Target countries or regions for international protection
  • Priority, assignment, licence or previous application information

Request an assessment for Integrated Circuit Topography

Our specialist team will contact you to clarify your objectives and plan the next steps.

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